High-Performance 3D X-ray Inspection – Cheetah EVO

The Cheetah EVO is a high-performance 3D X-ray inspection system designed to meet demanding quality requirements in SMT manufacturing, semiconductor applications and laboratory analysis. It delivers fast, reliable and repeatable inspections, whether operated manually or in fully automated mode. The system includes automatic void calculation via VoidInspect, enabling rapid and non-destructive analysis of solder-joint voids. Image quality is enhanced through user-friendly dynamic filters such as eHDR, while the micro3Dslice laminography function and FF CT software provide detailed, high-clarity 3D visualisation. Optional dose-reduction tools support the inspection of sensitive components by monitoring X-ray exposure and enabling low-dose detector operation. An optional water-cooled X-ray tube ensures stable focal performance, avoiding heat-related image distortion. The system can also be equipped with a high load-capacity stage (<20 kg), allowing inspection of multiple assemblies or interconnections in a single pass. Adapted for SMT and semiconductor inspection, the Cheetah EVO covers a broad range of applications including PCB assemblies, BTC, BGA, LGA, QFN/QFP, THT, IGBT, LED, MEMS and MOEMS. Integration into production environments is supported through ProLoop, enabling direct communication with in-line AOI and AXI systems. With its large flat-panel detectors offering up to 50% more field of view and advanced laboratory-grade imaging capabilities, the Cheetah EVO is well suited for detailed examination of microelectronic components, batteries, connectors and medical devices.